|
|
From standard technology to complex, high-density circuits incorporating the latest technology, Kingshine will keep you up-to-date with cutting edge advancements available in the market today.
&©|8226; Conventional rigid circuits
&©|8226; Rigid circuits with buried via holes and blind via holes
&©|8226; HDI rigid circuit with 1+n+1 / 2+n+2 / 3+n+3 / ELIC structure
&©|8226; Semi-flex PCBs
&©|8226; RF PCBs
&©|8226; Flex circuits
&©|8226; Rigid-flex circuits
&©|8226; Thermal clad
&©|8226; Metal, Aluminum, Copper, Ceramic and steel based PCBs
&©|8226; Heavy Copper and bondable PCBs
Capabilities
&©|8226; Rapid prototyping
&©|8226; Rigid boards from 1 to 48 layers
&©|8226; Flex circuits from 1 to 8 layers
&©|8226; HDI from 4 to 20 layers
&©|8226; Rigid-Flex from 4 to 16 layers with laser drills
&©|8226; Controlled Impedance: +/-8%
&©|8226; Thin laminate capability down to 2 mil
|
| Company: |
Kingshine electronic limited
|
| Contact: |
Ms. Helen Lin |
| Address: |
Guangming dstrict, Shenzhen |
| Postcode: |
518001 |
| Tel: |
86 15013431648 |
| Fax: |
|
| E-mail: |
|
|
|
|
Home
